During assembling PCB, there may be a lot of small issues, such as plating delamination and solder balls. So, why occur tin beads in PCB Assembly?
Reasons Why Occur Tin Beads in PCBA
1. When the PCB board leaves the liquid solder, it is super easy to form tin beads. This is because when the PCB board and the tin wave are separated, a tin column will be pulled between them. Once the tin column broken and dropped back to the tin cylinder, solder will sputter out, and the solder will fall on the PCB board to form tin beads. Therefore, when designing the tin wave generator and tin cylinder, attention should be paid to reducing the falling height of tin. Small drop height helps reduce dross and spatter.
2. The second reason for the formation of solder balls is the outgassing of volatile substances in the PCB board and solder mask. If there are cracks in the metal layer of the through hole of the PCB board, the volatilized gas of these substances will escape from the cracks after heating, forming tin beads on the component surface of the PCB board.
3. The third cause of solder ball formation is related to flux. Flux can be left under components or between the PCB and the carrier (a tray used for selective soldering). If the flux is not sufficiently preheated and burns out before the PCB touches the tin wave, tin spattering and beading can occur. Therefore, the preheat parameters recommended by the flux supplier should be strictly followed.
This is the reason for the formation of tin beads in PCB Assembly. Apart from that, there are also plenty of other tiny reasons that can cause tin beads. However, with the development of science and technology, technicians have also begun to have rich experience in the production of tin beads. It may be the charm of science and knowledge that it can quickly help technicians find ways to deal with it.
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