1. Preliminary preparation stage
> PCBA project specification, technical parameters and requirements;
>The lead group for the preparation of the project, responsible for process design, process implementation, project reporting, etc.
2. Design and development
The standard of this stage is to ensure the circuit design ability that is able to meet the SMT production process.
3. Design and editing of work instructions for SMT production process
>Clarify the format of the work instruction, which is consistent with pcba processing factory;
> The content of the operation instruction is clear (the operation instruction for solder paste selection, the operation instruction for the use of stencil, the patch processing operation instruction, the reflow welding process control instruction, etc.);
4. Confirmation of stencil production capacity
>The process of making stencil;
>The patch processing factory exports Gerber files suitable for stencil production from PCB files to guide the process of stencil production;
5. Confirmation of the programming and operating capabilities of the placement machine
> Evaluation of BOM list and Gerber file;
> Placement machine programming, PCB size measurement and board assembly processing;
6. PCBA test
> Test after SMT processing and production ( burning, signal, high and low temperature, ICT test, etc.);
> Three-proof paint coating, etc. (three-proof refers to which three-proof, please refer to our previous analysis of the problem);
7. PCBA SMT project improvement and evaluation
>PCBA design mutual inspection;
>Report;
>Suggestions for improvement.
